90
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microSYST Systemelectronic GmbH
a multi-step etch method for fabricating slightly tapered through-silicon vias based on modified bosch process A Multi Step Etch Method For Fabricating Slightly Tapered Through Silicon Vias Based On Modified Bosch Process, supplied by microSYST Systemelectronic GmbH, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more https://www.bioz.com/product/multi-taper+method/a+multi+step+etch+method+for+fabricating+slightly+tapered+through+silicon+vias+based+on+modified+bosch+process/pm38417167-399-43-44 Average 90 stars, based on 1 article reviews
a multi-step etch method for fabricating slightly tapered through-silicon vias based on modified bosch process - by Bioz Stars,
2026-10
90/100 stars
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